The role of liquid cooling plates in liquid cooling system

The water-cooled plate, a component for heat transfer through liquid cooling. The principle is to process the flow channel in the metal plate. After the electronic components are installed on the surface of the plate (the middle is coated with heat-conductive medium), the coolant enters from the inlet of the plate and exits to take away the heat emitted by the components. Common processes used to form liquid cooling plates runners include friction welding, vacuum brazing, buried copper pipes, and deep hole drilling, etc.

If the radiator is understood as a heat exchanger, then the radiator + liquid cooling plate + water pump + pipeline form a complete liquid cooling system. The liquid cooling plate is responsible for absorbing the heat of the heating element and conducting it into the flowing liquid, and the radiator is responsible for absorbing the heat from the liquid being added with fins, and then heat exchange between the outside air and the surface of the fins to achieve the purpose of cooling the components.

If the radiator is understood as a heat exchanger, then the radiator + liquid cooling plate + water pump + pipeline form a complete liquid cooling system. The liquid cooling plate is responsible for absorbing the heat of the heating element and conducting it into the flowing liquid, and the radiator is responsible for absorbing the heat from the liquid being added with fins, and then heat exchange between the outside air and the surface of the fins to achieve the purpose of cooling the components.   

Suzhou Trumony Aluminum Co. Ltd. mainly provides customers with related services and products such as battery thermal management solutions, liquid cooling system development, liquid cooling system design, liquid cooling materials, liquid cooling components, and liquid cooling assembly delivery. Our products mainly include liquid-cooled components for power battery packs, liquid-cooled components for energy storage battery packs, liquid-cooled components for high heat flux density heat exchange, and new water cooling heat exchange components, etc.